With hybrid bonding making the news for becoming the preferred choice of bonding for next-generation memory chips, a relaxation of standards by the Joint Electron Device Engineering Council (JEDEC) could lead to Samsung and SK hynix skipping the technology for HBM4 memory, suggests a report from the Korean press. The previous standards had determined that next-generation HBM memory would have a thickness of 900 micrometers, but the new standards could mean that the thickness is relaxed to 1,000 micrometers. Relaxed Standards Could Lead Manufacturers To Skip Hybrid Bonding For Next-Generation HBM, Says Report Word about SK hynix being interested in […]
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