The biggest hindrance to smartphone chipsets unlocking their potential is heat dissipation, and while TSMC’s 2nm process is expected to introduce some efficiency improvements, the ever-growing complexity and size of these SoCs mean that newer packaging needs to be adopted to break through the performance ceiling. One tipster notes that the industry has been discussing about companies like TSMC and Huawei exploring 3D packaging for the smartphone category, but the reality is that this technology offers far too many drawbacks for it to be adopted for this specific sector. Instead, these firms appear to focus solely on improving manufacturing processes. […]
Read full article at wccftech.com/tsmc-and-huawei-focused-on-improving-node-than-3d-packaging-due-to-heat-generation/
Hence then, the article about tsmc huawei are far from exploring 3d packaging for smartphone socs instead focusing on improving manufacturing processes due to thermal constraints was published today ( ) and is available on Wccf tech ( Middle East ) The editorial team at PressBee has edited and verified it, and it may have been modified, fully republished, or quoted. You can read and follow the updates of this news or article from its original source.
Read More Details
Finally We wish PressBee provided you with enough information of ( TSMC & Huawei Are Far From Exploring 3D Packaging For Smartphone SoCs, Instead Focusing On Improving Manufacturing Processes Due To Thermal Constraints )
Also on site :
- Someone Was Trying To Sell The Unreleased Galaxy S26 Ultra As Far Back As 1 Month Ago And Samsung Did Nothing
- Official Galaxy S26 Ultra Benchmarks Arrive Before Samsung’s Announcement; One Test Shows Thermal Problems Are Finally Addressed
- The latest update on the BioShock movie states "Netflix and Take-Two are very anxious" to line it up with the new game's release