The biggest hindrance to smartphone chipsets unlocking their potential is heat dissipation, and while TSMC’s 2nm process is expected to introduce some efficiency improvements, the ever-growing complexity and size of these SoCs mean that newer packaging needs to be adopted to break through the performance ceiling. One tipster notes that the industry has been discussing about companies like TSMC and Huawei exploring 3D packaging for the smartphone category, but the reality is that this technology offers far too many drawbacks for it to be adopted for this specific sector. Instead, these firms appear to focus solely on improving manufacturing processes. […]
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