The PlayStation 5 liquid metal cooling system has rapidly become infamous following the system's launch in 2020. Not only did the system prove to be somewhat unreliable in launch units, often leading to overheating issues, but the liquid metal itself would leak onto the system's APU and motherboard components, leading to widespread malfunctions that are still getting reported in droves. For the next-generation PlayStation 6, however, Sony Interactive Entertainment plans to handle cooling differently, judging from a new patent that recently surfaced online. As reported by Tech4Gamers, the PlayStation 6 may not use liquid metal cooling as its predecessor, but […]
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