Apple’s “go to” chipset packaging for its A-series of chipsets was InFO-PoP (Integrated Fan-Out Package-on-Package), which had its uses, but in the age of artificial intelligence, the technology was quickly becoming dated and introducing a ton of limitations, including thermal problems for running on-device AI operations. Thankfully, if there was one positive outcome for the AI boom, it’s that companies like Apple have been encouraged to research and develop newer packaging, as it has done with the A20 Pro and its Wafer-Level Multi-Chip Module Packaging (WMCM). Of course, that’s what a tipster claims and may not be the complete reality. The […]
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