Samsung has proven that it can develop cutting-edge lithography, with its upcoming Exynos 2700 serving as an excellent example, as the company has been reported to be progressing well with its next flagship SoC. However, as far as its 2nm GAA process goes, a rumor states that when comparing Power, Performance, and Area (PPA) metrics, TSMC’s 2nm N2P is ahead in the race. This may explain why, alongside improving its 2nm process, Samsung is also developing innovative heat dissipation solutions for its top-end chipsets, as it’s a means towards holding its own against the competition. Exynos 2700 to be aided by Samsung’s […]
Read full article at wccftech.com/exynos-2700-innovative-heat-dissipation-solutions-compensate-for-poor-2nm-gaa-process/
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