The HBM race has seen major acceleration across DRAM makers, and SK Hynix is showcasing its new HBM4E solution, which increases density & bandwidth. HBM4E Drives A 33% Die Density Uplift, and a 38% Boost in Memory Bandwidth, Setting Eyes at 4 TB/s for Next-Gen AI Datacenter Chips NVIDIA and AMD are going to utilize HBM4 to power their latest GPUs for AI datacenters this year. Both the Rubin and the MI400 series pack some big specifications, and the HBM solutions being used on them are one of the biggest innovations. The move to HBM4 delivers a significant improvement in […]
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