Apple currently employs “Flip-Chip” technology in its iPhone’s ultrawide-angle cameras, which, as the name suggests, flips the sensor so that its electrical contacts face the device’s logic board directly. While the benefit of this approach is that it allows Apple to make its devices thinner, it’s extremely difficult to manage proper heat transfer, which is why ultrawide-angle cameras are typically inferior to their wide-angle counterparts. However, an analyst predicts that the iPhone 21, which will succeed Apple’s 20th-anniversary model, is said to adopt a new technology that should potentially eliminate the heat problem for these ultrawide-angle sensors, enabling the company […]
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