High-Bandwidth Memory (HBM) won’t be limited to servers because the latest report states that Samsung is employing a unique packaging technology that will make smartphones and tablets compatible with these ultra-fast DRAM chips. The goal for the Korean giant is to turbocharge mobile devices into on-device AI beasts, and looking at the profits that Samsung is raking in during the ongoing shortage, the company surely doesn’t want to miss out on any markets. The objective is to develop HBM technology tailor-made for smartphones and tablets to prevent unnecessary space and power hurdles Traditional mobile DRAM utilizes copper wire bonding, but […]
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