Samsung was considering removing Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700 as part of its cost-cutting strategy to make its upcoming Galaxy S27 series more affordable for the masses amid the DRAM shortage. Fortunately, a new rumor has dispelled these claims, stating that the Korean giant fully intends to treat its next 2nm chipset with the best in-house technologies possible to raise the competitive bar. Maintaining FOWLP technology on the Exynos 2700 helps the latter to maintain better performance when running taxing workloads Aside from removing FOWLP from the Exynos 2700, Samsung was also rumored to switch to BOE’s […]
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