Apple is beginning to lay the critical groundwork for its next-gen custom chips, including a much-anticipated server chip, dubbed Baltra, as per a new analysis from Morgan Stanley Apple is increasing its reservation slots for TSMC's SoIC packaging tech in anticipation of its next-gen custom chips, including the Baltra ASIC Morgan Stanley has noted in a fresh analysis that Apple is "ramping up" SoIC-related activity at TSMC: "Apple is materially ramping SoIC capacity at TSMC, pointing to a major push in Apple silicon for AI servers. TSMC (covered by Charlie Chan) is expanding its SoIC (System on Integrated Circuit) capacity, […]
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