One of the M5 Pro’s and M5 Max’s biggest highlights is that both chipsets are rumored to feature TSMC’s SoIC packaging (Small Outline Integrated Circuit) and a 2.5D chiplet design that will enable the company to mass produce even more capable SoCs at a lower cost. A new rumor pretty much repeats the same information, talking about the advantages of the new Apple Silicon lineup, while also mentioning that both the M5 Pro and M5 Max will feature a slightly higher transistor density. The new chiplet design for the M5 Pro and M5 Max is expected to allow unique CPU and GPU […]
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