Intel Gives Rundown on 14A/18A Chips & Advanced Packaging Opportunities, Revealing Customer Commitments Expected to Flow In by H2 2026 ...Middle East

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Intel Gives Rundown on 14A/18A Chips & Advanced Packaging Opportunities, Revealing Customer Commitments Expected to Flow In by H2 2026

Well, at Intel's Q4 earnings call, CEO Lip-Bu Tan and CFO David Zinsner made several remarks suggesting that the foundry division is progressing with steady momentum. Intel Is Projecting "Billions in Revenue" From Chip & Advanced Packaging Commitments While at the consumer/DCAI front, Team Blue showed sluggish progress in maintaining a balance between the two businesses, but when it comes to how Intel Foundry is evolving, CEO Lip-Bu Tan gave us an extensive rundown of how nodes are progressing and customer sampling. Talking about the 18A and derivatives, Lip-Bu Tan revealed that the company is now moving towards supplying PDK […]

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