AI-related demand for high-bandwidth memory (HBM) is now producing tangible aftershocks across the global semiconductor industry, tightening wafer foundry capacity and squeezing out the supply of DRAMs often used in smartphones SoCs, such as the DDR5. And, MediaTek is likely to be the first major SoC manufacturer to get affected. LPDDR5x delivery period is now stretching out to between 26 and 39 weeks, which means orders placed right now won't be delivered until the middle of 2026 As per a report by Taiwan's Commercial Times, the high demand for HBM is now affecting the smartphone SoC manufacturers in two distinct […]
Read full article at wccftech.com/ai-related-hbm-demand-squeezing-out-ddr5-capacity-and-tightening-wafer-supply-mediatek-in-the-eye-of-the-storm/
Hence then, the article about ai related hbm demand squeezing out ddr5 capacity and tightening wafer supply mediatek in the eye of the storm was published today ( ) and is available on Wccf tech ( Middle East ) The editorial team at PressBee has edited and verified it, and it may have been modified, fully republished, or quoted. You can read and follow the updates of this news or article from its original source.
Read More Details
Finally We wish PressBee provided you with enough information of ( AI-Related HBM Demand Squeezing Out DDR5 Capacity And Tightening Wafer Supply -MediaTek In The Eye Of The Storm )
Also on site :
- Thermal Grizzly Deltamate GPU Block Reduces ROG Astral RTX 5080’s Temperature By Nearly 20°C, Der8auer Demonstrates
- Black & White at 25: how Lionhead's hairbrained, stoner-powered game design became the harbinger of modern AI
- China’s Chip Industry Depends on One Key Piece of Equipment from ASML, and the U.S. Is Now Moving to Ban It
