The newer 2nm process can continue to utilize the current EUV machines that TSMC has in place for mass producing wafers with a higher yield percentage, but as the Taiwanese semiconductor behemoth moves to sub-2nm nodes like 1.4nm and 1nm, also known as A14 and A10, respectively, it will run into manufacturing roadblocks. Now, this problem can easily be scaled with the purchase of ASML’s cutting-edge High-NA EUV machinery, but a new report states that instead of making the purchase, TSMC will move to photomask pellicles. Photomask pellicles are expected to be less costly than purchasing a $400-million-dollar High-NA EUV […]
Read full article at wccftech.com/tsmc-to-use-photomask-pellicles-instead-of-high-na-euv-machines-for-1-4nm-and-1nm-processes/
Hence then, the article about tsmc resorting to photomask pellicles instead of transitioning to the ludicrously expensive high na euv machines for 1 4nm 1nm advanced processes was published today ( ) and is available on Wccf tech ( Middle East ) The editorial team at PressBee has edited and verified it, and it may have been modified, fully republished, or quoted. You can read and follow the updates of this news or article from its original source.
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