NVIDIA’s B30A ‘Blackwell’ Chip For China Rumored to Feature Dual-Die Design, 8-Hi HBM3E & TSMC’s N4P Process; Expected to Release By Q4 2025 ...Middle East

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NVIDIA’s B30A ‘Blackwell’ Chip For China Rumored to Feature Dual-Die Design, 8-Hi HBM3E & TSMC’s N4P Process; Expected to Release By Q4 2025

NVIDIA's next Blackwell chip for China's AI markets, the B30A, is set to feature HBM3E memory, with performance uplifts driven by architectural advancements. NVIDIA's B30A Chip Could Feature Serious Upgrades Over the H20, Credits To The Chiplet Configuration Recently, there have been speculations about the next step NVIDIA would take for the Chinese AI markets. It needs to come up with an effective solution soon to maintain market dominance. Now, in an analysis by GF Securities, it is revealed that the B30A chip is the next candidate for NVIDIA's flagship offering in China, and compared to the H20 AI chip, […]

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