SK hynix Begins Supplying Mobile DRAM With 3.5x Better Thermal Conductivity, Solving Performance Throttling For On-Device AI & More ...Middle East

Wccf tech - Technology
SK hynix Begins Supplying Mobile DRAM With 3.5x Better Thermal Conductivity, Solving Performance Throttling For On-Device AI & More

Smartphone DRAM and memory manufacturers are researching towards launching faster and more efficient chips to excel in the use of on-device AI applications and to offset the performance throttling issues encountered by the current technology. SK hynix, which has surpassed Samsung in the technological aspect of memory manufacturing, has said that it has begun supplying a newer form of mobile DRAM that adopts an industry-first ‘Molding Compound’ that is designed to tackle overheating in smartphones. The company claims the latest memory chips’ thermal conductivity has improved by 350 percent. The new material used on SK hynix’s mobile DRAM is called […]

Read full article at wccftech.com/sk-hynix-develops-mobile-dram-with-better-thermal-conductivity-for-on-device-ai/

    Hence then, the article about sk hynix begins supplying mobile dram with 3 5x better thermal conductivity solving performance throttling for on device ai more was published today ( ) and is available on Wccf tech ( Middle East ) The editorial team at PressBee has edited and verified it, and it may have been modified, fully republished, or quoted. You can read and follow the updates of this news or article from its original source.

    Read More Details
    Finally We wish PressBee provided you with enough information of ( SK hynix Begins Supplying Mobile DRAM With 3.5x Better Thermal Conductivity, Solving Performance Throttling For On-Device AI & More )

    Apple Storegoogle play

    Last updated :

    Also on site :

    Most viewed in Technology