A multitude of cutting-edge chips will leverage TSMC’s 2nm process next year, with the world’s biggest semiconductor manufacturer already having a headstart by reportedly taking orders for its wafers from the month of April. For years, the company has relied on Chinese chipmaking equipment to complete its ambitious goals, but with the U.S. administration breathing down its neck, a new report states that TSMC has little choice but to phase out these tools in favor of an alternative. The initial plan for TSMC was to replace existing Chinese chipmaking tools for its 3nm process, but there were too many complexities […]
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