Apple To Swift From InFO To Wafer-Level Multi-Chip Module Packaging For The iPhone 18’s A20 SoC In 2026, Reducing Unnecessary Production Costs As It Moves To TSMC’s 2nm Process While Boosting Efficiency & Yields ...Middle East

The A20 and the A20 Pro will potentially be Apple’s first 2nm chipsets that will be found in the iPhone 18 series, with the company jumping to the newer lithography thanks to TSMC’s continued efforts. Unfortunately, this shift will not be cheap, as each wafer manufactured using the cutting-edge process is estimated to cost $30,000, making the Cupertino giant one of the few names that will jump on the 2nm bandwagon. However, according to one analyst, the company will be looking at other packaging technologies to improve the chipset’s attributes and lower costs, with the A20 expected to gravitate from […]

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Hence then, the article about apple to swift from info to wafer level multi chip module packaging for the iphone 18 s a20 soc in 2026 reducing unnecessary production costs as it moves to tsmc s 2nm process while boosting efficiency yields was published today ( Tuesday 12/08/2025 - 07:53 PM ) and is available on Wccf tech ( Middle East ) The editorial team at PressBee has edited and verified it, and it may have been modified, fully republished, or quoted. You can read and follow the updates of this news or article from its original source.

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