MediaTek is preparing to launch the Dimensity 9500 later this year, and being fabricated on TSMC’s third-generation 3nm process, or ‘N3P,’ will open up more performance possibilities for the company to compete with its rivals from Apple and Qualcomm. A tipster has now shared some specifications of the upcoming flagship SoC, while also stating some estimated single-core and multi-core scores. In short, the Dimensity 9500 will give the A19 Pro a run for its money. More specification details mention that the Dimensity 9500 will offer an upgraded all-core architecture, with bumps in the L3 and SLC cache While the CPU […]
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