Samsung Electronics is taking a major step in the right direction in semiconductor innovation by planning to adopt glass substrate in chip packaging starting in 2028. If you are not familiar, the transition marks a major shift from silicon-based interposers to glass interposers, and it is the first time the company has laid out an official roadmap for the evolution, according to ETNews. Samsung’s glass interposers could revolutionize AI chip packaging by offering better performance, lower costs, and faster production In chip manufacturing, interposers are a key component in 2.5D chip packaging, especially for AI semiconductors, where the GPUs are […]
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