US, India, Japan, Australia To Sign Pact For Stepping Up Chip Production, Move To Cut China To Size ...Middle East

New Delhi: The United States, Japan, India and Australia are likely to sign an agreement to take steps to build secure semiconductor chip supply chains when they meet in Washington for the Indo-Pacific Quad summit next week, according to a report Japans Nikkei newspaper. The move is aimed at reducing the dependence for semiconductor chips […] The post US, India, Japan, Australia To Sign Pact For Stepping Up Chip Production, Move To Cut China To Size appeared first on Ommcom News.

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