Apple To Swift From InFO To Wafer-Level Multi-Chip Module Packaging For The iPhone 18’s A20 SoC In 2026, Reducing Unnecessary Production Costs As It Moves To TSMC’s 2nm Process While Boosting Efficiency & Yields ...Middle East

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Hence then, the article about apple to swift from info to wafer level multi chip module packaging for the iphone 18 s a20 soc in 2026 reducing unnecessary production costs as it moves to tsmc s 2nm process while boosting efficiency yields was published today ( Tuesday 12/08/2025 - 07:53 PM ) and is available on Wccf tech ( Middle East ) The editorial team at PressBee has edited and verified it, and it may have been modified, fully republished, or quoted. You can read and follow the updates of this news or article from its original source.

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