The SGA and the Division of Student Life launched a new Student Engagement Stipend Jan. 12 that offers eligible undergraduates up to $150 to help pay for costs tied to academic and campus involvement opportunities.
The stipend can be used for expenses such as conference registration or travel, research costs, organization or honors society dues and exam preparation for professional school.
Students can apply online through Feb. 12. The application asks students to describe the activity and estimated cost, explain how it supports their development and include a brief statement describing financial need.
Samantha Simmons, SGA vice president for academic affairs, said the idea took shape after she attended the SEC Student Government Exchange, where she saw how peer institutions including Vanderbilt University and the University of Arkansas used stipends to make academic and leadership opportunities more accessible.
She said the stipend is designed for students from all backgrounds.
“There is no single student persona for this stipend,” she said, adding that the review process is designed to be holistic because financial strain can hit students at different points in their college careers.
Student Life says any current undergraduate student with “demonstrated financial need” may apply, even if that need doesn’t meet federal guidelines.
Applications are reviewed by a committee of students, faculty and staff, with Student Life removing names before reviews to support fairness. Funds are transferred to a student’s account once approved, with SGA noting some payments may be issued directly to sponsoring student organizations.
Simmons said she wants students to know “they are not alone,” and that campus leaders see the pressure students feel to achieve “high test scores, strong résumés, and unique experiential opportunities,” that often come with hidden costs.
“I hope students become aware of this stipend and take advantage of it because they are not alone in their journey to become the best version of themself,” she said.
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